新版iPhone注定只能算4.5代？

苹果的下一代手机iPhone5会给我们带来什么惊喜？ 可能运行快一点？搭配一个稍微大一点、更高分辨率的显示屏幕和摄像头？采用更快的（HSDPA+）网络链接？但这些升级的内容，不足以配的上iPhone5这个名字。不过为了对得起Apple做的努力，我们姑且可以给这部手机起个名字叫iPhone 4+。 另一方面，从报告看来，对于那些已经用到iPad2设计里的芯片，有希望在下一代iPhone上进行产品升级。 竞争最激烈的还是基带处理器，从现在的情况看，苹果会在3G版手机使用英飞凌芯片，而CDMA版本则继续使用高通的MDM6600。 UBM TechInsights的高级技术分析师史蒂夫说，在3G方面，苹果公司可能会升级到英飞凌X-GOLD 626或706，以便支持HSDPA+网络。 点击这里进入EE Times，阅读保密版完整的故事。 编译：Luffy Liu 本文授权编译自EE Times，版权所有，谢绝转载 参考英文原文：Next iPhone looks to be an underachiever，by Rick Merritt

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{pagination} Next iPhone looks to be an underachiever Rick Merritt Apple Inc.’s next-generation handset is likely to run a bit faster; sport a somewhat larger, higher-resolution display and camera; and link to faster (HSDPA+) networks. But the incremental upgrade will not merit the name iPhone 5. We give the handset a C for effort and dub it the iPhone 4+. On the other hand, the accompanying report card looks bright for the chip vendors already designed into the iPad 2; most have a better-than-average shot of getting sockets in the evolutionary smartphone. The most heated competition will be over baseband processors, where the likely scenario sees Apple continuing to use its tried-and-true Infineon chips for 3G phones and the Qualcomm MDM6600 for the CDMA versions. On the 3G side, Apple may upgrade to Infineon’s X-Gold 626 or 706 to pick up support for HSDPA+ networks, says Steve Bitton, senior technology analyst at our partner UBM TechInsights. Click here to read the full story at EE Times Confidential.