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和硕已获苹果iPhone5和iPad3订单?

一位不愿意透露姓名的内人士称,合约电子制造商和硕公司已经获得了苹果公司的15万部iPhone4S智能手机订单。而且有望成为苹果的供应链的一部分。。。

据台湾经济新闻报道,一位不愿意透露姓名的内人士称,合约电子制造商和硕公司已经获得了苹果公司的1500万部iPhone4S智能手机订单。 和硕本次取得大量订单,业界普遍认为是从他们的最强竞争对手——鸿海精密公司(富士康)虎口夺食。富士康此前一直被认为是苹果的御用制造商,承包了所有iPhone和iPad的代工业务。

《国际电子商情》PpCesmc

报道称,和硕(台湾台北)已经完成iPhone4S的生产,并且将在第四季度出货200至250万台,预计达到iPhone4S出货总量的10%。 报道还指出,和硕有望成为苹果的供应链的一部分,并获得iPhone 5和iPad3订单。 和硕的野心其实一早已经展露无疑,他们制造的金属拉丝外观的PC和平板电脑外壳,是苹果工业设计中的最爱。这种金属PC外壳制造的技术还帮助和硕赢得了不少ultrabook和上网本业务。报告说,他们最近还获得了来自华硕和联想的订单。 编译:Luffy Liu 参考英文原文:Pegatron is Apple iPhone maker, says report,by Peter Clarke 本文授权编译自EE Times,版权所有,谢绝转载

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{pagination} Pegatron is Apple iPhone maker, says report Peter Clarke LONDON – Contract electronics manufacturer Pegatron Corp. has won an order to make 15 million iPhone 4S smartphone from Apple Inc., according to a Taiwan Economic News report that referenced un-named industry sources. The win is thought to be a steal from fellow Taiwanese contract manufacturer Hon Hai Precision Inc. (Taipei, Taiwan), which trades as Foxconn using massive manufacturing capacity in China, and which had been thought to be an exclusive supplier to Apple of contract manufacturing services for the iPhone and the iPad. Pegatron (Taipei, Taiwan) is already making the iPhone 4S units and will finish the fourth quarter with shipments of between 2 and 2.5 million units, or about 10 percent of the expected total iPhone shipments, the report said. Pegatron is expected to become an established part of Apple's supply chain and be asked to make the iPhone 5 and iPad 3, the report added. Early signs of Pegatron's ambition have been seen in an expansion of its ability to make brushed metal PC and tablet computer housings, the sort preferred by Apple. This expansion of metal PC housing manufacture is helping Pegatron win ultrabook and netbook business. It has recently won orders from Asus and Lenovo, the report said.
本文为国际电子商情原创文章,未经授权禁止转载。请尊重知识产权,违者本司保留追究责任的权利。
Peter Clarke
业内资深人士Peter Clarke负责EETimes欧洲的Analog网站。 由于对新兴技术和创业公司的特殊兴趣,他自1984年以来一直在撰写有关半导体行业的文章,并于1994年至2013年为EE Times美国版撰稿。
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