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英特尔开始在爱尔兰部署14nm晶圆厂

英特尔日前公布了将部署14nm及以下制程的晶圆厂投资计划。据表示,总投资金额将超过十亿美元。

英特尔(Intel)日前公布了将部署14nm及以下制程的晶圆厂投资计划。据表示,总投资金额将超过十亿美元。 英特尔(Intel) CEO Paul Otellini稍早前说明了英特尔的晶圆厂部署14nm及未来更先进制程的蓝图及相关投资规划。这些晶圆厂包括了位在美国奥勒冈州的D1X晶圆厂、位在亚利桑那州的Fab42厂,以及位在爱尔兰Leixlip的Fab24厂。 Otellini表示,英特尔在奥勒冈州、亚利桑那州和爱尔兰的晶圆厂将开始部署可用于14nm及以下制程的设备。该公司预计2013年14nm制程可上线运转。

Intel 14nm Fab部署vMJesmc

英特尔于2009年关闭了位在都柏林附近Leixlip的Fab14厂,将当地晶圆厂的数量减少至三个,分别为Fab10, 24和24-2。2011年1月,英特尔花费约五亿美元重建Fab14旧厂,但当时并未说明翻新这座晶圆厂的详细规划。 编译: Joy Teng 本文授权编译自EE Times,版权所有,谢绝转载 本文下一页:参考英文原文:Intel confirms Ireland for 14-nm silicon ,by Peter Clarke

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{pagination} Intel confirms Ireland for 14-nm silicon Peter Clarke LONDON – The Intel wafer fab complex in Leixlip, Ireland, is set to receive investment to allow it to manufacture 14-nm silicon and beyond, the company revealed in a presentation to analysts on May 10. The investment is expected to be more than $1 billion. The presentation, given by Intel CEO Paul Otellini, included a slide that detailed three Intel fabs set for investment for 14-nm and beyond. These are fab D1X in Oregon, Fab 42 in Arizona and Fab 24 in Leixlip near Dublin, Ireland. "We're in the process of construction and initial deployment of equipment into 14-nm and beyond in Oregon, Arizona and Ireland," Otellini said in a presentation that was also capturesd as a webcast. The 14-nm process technology is expected to start being used in 2013. Intel was reported to have chosen Ireland over Israel for the 14-nm investment back in September 2011. Intel is bringing up 22-nm production at Fab 28 in Kiryat Gat, Israel. Intel closed down its Fab 14 in Leixlip near Dublin in the summer of 2009 reducing the number of fabs it operates on the campus to three, labeled Fabs 10, 24 and 24-2. In January 2011 Intel committed to spend about $500 million rebuilding the shell and infrastructure of the old Fab 14 building, but without saying what plans it had for manufacturing process technologies in the reconditioned shell.
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Peter Clarke
业内资深人士Peter Clarke负责EETimes欧洲的Analog网站。 由于对新兴技术和创业公司的特殊兴趣,他自1984年以来一直在撰写有关半导体行业的文章,并于1994年至2013年为EE Times美国版撰稿。
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