在本周于美国举行、聚集众多顶尖微处理器架构师的年度 Hot Chips 大会上,发表多场演说的ARM是聚光灯焦点之一,但显然英特尔(Intel)仍是微处理器领域的霸主。IBM与甲骨文(Oracle)也藉由大会上的演说展示其Power 8与Sparc架构仍在市场上各自占有一席之地,而这两家公司表示,芯片堆栈方案正在崛起。
值 得一提的是,在这为期三天的Hot Chips大会上,笔者完全没听到有人提“CPU”这个缩写,看来它已经是过气的名词。主流28纳米制程技术的问世──以及少数以更具侵略性制程节点生产 的芯片──显然已经让微处理器演进至系统级芯片(SoC)时代。可能这样的历史趋势正是 ARM 在大会上备受瞩目的原因;x86或许仍是重量级架构,但ARM核心则是会出现在大多数工程师的设计中。以下是 2014年度的Hot Chips大会重点摘录。
ARM在物联网世界试水温
ARM首席技术官Mike Muller介绍了一款嵌入了传感器中枢(sensor hub)、锁定物联网(IoT)应用的测试芯片;Muller表示他上一次在Hot Chips大会介绍ARM技术得回溯到1992年。
ARM介绍内嵌传感器中枢的物联网芯片
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此外,Muller也呼吁工程师们参与将接棒今日DDR4规格的Jedec 内存新标准订定。
目前市面上的解决方案大多采用离散式的传感器中枢芯片
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本文下一页:AMD首款ARM架构服务器SoC——“西雅图”亮相
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AMD的ARM架构服务器SoC亮相
AMD 在大会上介绍第一款采用ARM架构的服务器SoC,代号Seattle;这款芯片预定在今年底前量产。Insight64分析师Nathan Brookwood表示,该款芯片采用标准ARM 64位核心,可能会吸引对一些采用客制化核心之竞争产品兼容性有疑虑的客户。
AMD的Seattle服务器SoC架构
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如同众多服务器SoC,内存在Seattle芯片内扮演主要角色
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本文下一页:Applied Micro展示X-Gene产品蓝图
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Applied Micro展示X-Gene产品蓝图
Applied Micro的40纳米X-Gene系列ARM核心64位服务器SoC已经量产,该公司在大会上介绍的是还在开发阶段的第二代X-Gene,以及计划才刚成形的第三代。
Applied Micro展示X-Gene 产品蓝图
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如同AMD的Seattle,Applied Micro介绍其第二代X-Gene芯片将配备8颗64位ARM 核心,初估该芯片性能将比第一代高出30~100%。
Applied Micro的第二代X-Gene芯片架构
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第二代X-Gene芯片性能与前一代产品之比较
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本文下一页:英特尔Avoton定位低功耗服务器等级SoC
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英特尔Avoton要求低功耗
处理器龙头英特尔在大会上介绍了第二代Atom核心服务器SoC,代号Avoton;该芯片试图与ARM架构服务器芯片一较高下,自定位为低功耗的服务器等级SoC。
英特尔介绍低功耗Atom核心服务器芯片Avoton
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英特尔表示Atom架构芯片已经获得众多客户采用
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本文下一页:英伟达“丹佛”芯片仍将锁定移动设备应用
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Nvidia的Denver芯片仍将锁定移动设备应用
Nvidia的客制化64位ARM核心芯片Denver,是以行动SoC的身分首度亮相;据业界消息,该公司已经取消了进军服务器应用的计划,但对此该公司不愿评论。
Nvidia介绍64位行动处理器Denver
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据了解,Denver原本将采用收购自Transmeta 的技术、为x86架构芯片,后来却演变成采用了一种新式执行优化功能,取代其他竞争对手所采用的全乱序执行(full out-of-order)设计(参考阅读
《揭密英伟达客制化64位ARM核心处理器》)。
Nvidia的Denver芯片支持执行优化功能
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本文下一页:已经收归英特尔旗下的安华高网络处理器Axxia
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已经收归英特尔旗下的Avago网络处理器Axxia
安华高(Avago)在Hotchips大会上介绍收购自LSI的ARM核心网络处理器Axxia,但在那之后过两天,该芯片就已经卖给英特尔;据分析师表示,英特尔将会利用从英飞凌(Infineon)收购的手机应用处理器技术,以x86架构设计下一代的Axxia芯片。
Axxia网络处理器架构
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本文下一页:IBM为Power 8打造新软件
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IBM为Power 8打造新软件
IBM在去年的Hot Chips大会发表Power 8处理器,今年则是为该款芯片开发了新的软件堆栈;Power架构是开放给所有芯片与系统开发商的资源,IBM改写了其软件堆栈,包括新版本的Linux、新的hypervisor、新的韧体等等。
IBM为Power 8打造新软件
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Power 8首度登场时被誉为最具扩充性的服务器处理器
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本文下一页:甲骨文介绍32核心Sparc处理器
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甲骨文介绍32核心Sparc处理器
甲骨文在大会上介绍其迄今最大规模的Sparc处理器芯片M7,内含32颗多执行续(multithreaded)核心,可扩充为32路、8,000执行续的系统。市场研究机构Brookwood的分析师形容,M7的内存层级、互连以及高速缓存容量之可扩充性令人惊艳,是一款“大气”的芯片。
甲骨文32核心Spac处理器M7
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M7 是为甲骨文的软件堆栈量身打造,Tirias Research分析师Kevin Krewell表示,其功能包括Java垃圾回收加速(garbage collection acceleration),以及一款甲骨文数据库查询加速器(query accelerator)。
M7处理器性能一览
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本文下一页:AMD公开CPU/GPU组合芯片Kaveri细节
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AMD公开CPU/GPU组合芯片Kaveri细节
AMD 也在大会上公开了客户端运算CPU/GPU组合芯片Kaveri的细节,这款芯片在去年首度亮相,值得一探究竟的原因是,该芯片采用AMD的异质系统架构 (Heterogeneous Systems Architecture,HSA)是首款支持连贯性连结(coherent connection),以及CPU与GPU之间的完全内存共享。现在的疑问是谁将采用第二代HSA芯片?何时有产品上市?
CPU/GPU组合芯片Kaveri架构
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Kaveri采用AMD的异质系统架构
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本文下一页:SK海力士介绍自家芯片堆栈方案
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SK海力士介绍自家芯片堆栈方案
Xilinx率先以2.5D芯片堆栈将内存与FPGA并排放置在一片基板上,SK海力士(Hynix)则表示那只是开始,接下来将是绘图处理器芯片、网络芯片堆栈…有一天也许能迭出一支智能手机所需的各种功能。
SK海力士介绍其芯片堆栈方案
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SK海力士也详细介绍了其高带宽内存(High Bandwidth Memory)的进展。
SK海力士的高带宽内存
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本文下一页:创新芯片无线堆栈技术
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创新芯片无线堆栈技术
微处理器领域的资深工程师Dave Ditzel表示,新创公司ThruChip Communications开发出一种能跨越芯片无线分配电力的方法,这种技术与该公司在芯片之间传递数据的电感耦合技术结合,可做为取代昂贵且复杂之硅穿孔技术的替代方案。
ThruChip Communications开发的芯片无线堆栈技术架构
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该种耦合技术甚至看起来更适合目前新开发的超薄晶圆技术,因为薄芯片可适合更小的感应线圈。
新开发的超薄晶圆技术
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本文下一页:微软和百度都打算用FPGA来加速数据中心
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其他热门话题
在今年Hot Chips大会上最热门的、运算领域以外的话题,一个是微软(Microsoft)打算采用Altera的FPGA来加速其数据中心的Bing服务,为可程序化逻辑组件开启了新应用;而百度(Baidu)也表示将支持这样的转变。
微软数据中心将利用Altera FPGA加速Bing服务
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此外有一家比特币采矿机(bitcoin mining)新创公司,采用高程度的设计重复使用方法,在不到一年时间内让整体系统速度破纪录。
重复使用设计方案协助业者大幅提升系统性能
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本文授权编译自EE Times,版权所有,谢绝转载
编译:Judith Cheng
参考英文原文:25 Views of Hot Chips 2014,by Rick Merritt
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25 Views of Hot Chips 2014
Rick Merritt
CUPERTINO, Calif. — ARM commanded much of the spotlight with a half-dozen presentations at Hot Chips, an annual gathering of top microprocessor architects. But the event made it clear Intel is still king of the silicon hill.
IBM and Oracle gave talks showing their Power 8 and Sparc architectures are still very much in the game. And two talks showed that chip stacks are on the rise.
One acronym I never heard uttered during the three-day event was CPU, a term that has become so last century. The advent of mainstream 28nm process technology -- and a handful of chips built on more aggressive nodes – has clearly morphed the microprocessor into the SoC era.
Perhaps this historical trend is why ARM figured so prominently in the proceedings. The x86 may still be the 900-pound gorilla, but the ARM core is the one available for most engineer’s designs.
ARM tests IoT
ARM's CTO Mike Muller described a test chip for the Internet of Things that embedded a sensor hub (below), a separate chip in some of today's products. Muller noted back in 1992 he gave the sole ARM paper at Hot Chips. Fast forward to 2014 and his talk was one of six on ARM chips.
ARM's CTO Mike Muller described a test chip for the Internet of Things that embedded a sensor hub (below), a separate chip in some of today's products. Muller noted back in 1992 he gave the sole ARM paper at Hot Chips. Fast forward to 2014 and his talk was one of six on ARM chips.
Separately, Muller also called for engineers to get involved in a new Jedec memory standard that will be a follow on to today's DDR4 spec.
Separately, Muller also called for engineers to get involved in a new Jedec memory standard that will be a follow on to today's DDR4 spec.
AMD tours Seattle
AMD described Seattle, its first ARM-based server SoC. It aims to have it in production before the end of the year. Use of a standard ARM 64-bit core may attract buyers concerned about possible incompatibility issues with custom cores some competitors are designing, said analyst Nathan Brookwood of Insight64.
AMD described Seattle, its first ARM-based server SoC. It aims to have it in production before the end of the year. Use of a standard ARM 64-bit core may attract buyers concerned about possible incompatibility issues with custom cores some competitors are designing, said analyst Nathan Brookwood of Insight64.
As is the case with many server SoCs, memory dominates the Seattle die.
Applied Micro shows XGene road map
Applied Micro said it has production volumes of its 40nm X-Gene, one of the first 64-bit ARM-based server SoCs to hit the market. It detailed its second-generation now in the lab and sketched out rough plans for a third generation.
Applied Micro said it has production volumes of its 40nm X-Gene, one of the first 64-bit ARM-based server SoCs to hit the market. It detailed its second-generation now in the lab and sketched out rough plans for a third generation.
Like AMD's Seattle, Applied's Shadowcat, its second-generation X-Gene will sport eight 64-bit ARM cores(see above). Initial performance figures show the chip offering a 30-100% performance boost over the first-gen part (see below).
Like AMD's Seattle, Applied's Shadowcat, its second-generation X-Gene will sport eight 64-bit ARM cores(see above). Initial performance figures show the chip offering a 30-100% performance boost over the first-gen part (see below).
Intel rules the microserver
Intel described Avoton, its second-generation Atom-based server SoC, intended to stave off competition from ARM-based servers. As it turned out competitors have hardly made it to market. Meanwhile Intel grabbed the early sockets for low-power server-class SoCs (see below).
Intel described Avoton, its second-generation Atom-based server SoC, intended to stave off competition from ARM-based servers. As it turned out competitors have hardly made it to market. Meanwhile Intel grabbed the early sockets for low-power server-class SoCs (see below).
Nvidia's Denver stays mobile
Denver, Nvidia's custom 64-bit ARM core, made its debut in a mobile SoC. Reports say Nvidia cancelled its plans for a server part, but the company declined comment.
Denver, Nvidia's custom 64-bit ARM core, made its debut in a mobile SoC. Reports say Nvidia cancelled its plans for a server part, but the company declined comment.
Initially, Denver was going to be an x86 chip, reportedly using technology from Transmeta. But it morphed instead into an ARM chip using a novel optimizer as an alternative to doing a full out-of-order design like its server SoC competitors Applied Micro, Broadcom and Cavium. It may take until some time in 2015 befor benchmarks with all the chips determine which route was best for performance/Watt.
Initially, Denver was going to be an x86 chip, reportedly using technology from Transmeta. But it morphed instead into an ARM chip using a novel optimizer as an alternative to doing a full out-of-order design like its server SoC competitors Applied Micro, Broadcom and Cavium. It may take until some time in 2015 befor benchmarks with all the chips determine which route was best for performance/Watt.
Intel grabs Avago's Axxia
Avago described Axxia, the ARM-based networking SoC it acquired with LSI. Two days later it sold the chip to Intel which is expected to design a next-generation part based on the x86, the approach Intel took with the mobile application processor it acquired with Infineon, noted analyst Brookwood.
Avago described Axxia, the ARM-based networking SoC it acquired with LSI. Two days later it sold the chip to Intel which is expected to design a next-generation part based on the x86, the approach Intel took with the mobile application processor it acquired with Infineon, noted analyst Brookwood.
Power 8 revamps software
The big news about IBM's Power 8, disclosed at last year's event, was a new software stack (see above). In an effort to make Power open to any chip or system developer, IBM re-wrote its software stack including a new version of Linux, a new hypervisor, new firmware, and other goodies.
The big news about IBM's Power 8, disclosed at last year's event, was a new software stack (see above). In an effort to make Power open to any chip or system developer, IBM re-wrote its software stack including a new version of Linux, a new hypervisor, new firmware, and other goodies.
Power 8 was hailed as one of the most scalable server processors when it originally debuted.
Oracle packs 32 Sparc cores
Oracle disclosed its largest Sparc chip to date. The M7 packs 32 multithreaded cores and can expand into a 32-way system with 8,000 threads. 'I was blown away by the scalability of the M7 in the memory hierarchy, interconnect and cache sizes. This is a big ambitious chip,' said analyst Brookwood.
Oracle disclosed its largest Sparc chip to date. The M7 packs 32 multithreaded cores and can expand into a 32-way system with 8,000 threads. "I was blown away by the scalability of the M7 in the memory hierarchy, interconnect and cache sizes. This is a big ambitious chip," said analyst Brookwood.
The M7 is tailored for Oracle's software stack, sporting 'features such as Java garbage collection acceleration and an Oracle database query accelerator,' said analyst Kevin Krewell of Tirias Research.
The M7 is tailored for Oracle's software stack, sporting "features such as Java garbage collection acceleration and an Oracle database query accelerator," said analyst Kevin Krewell of Tirias Research.
AMD's coherant message
AMD did a deep dive on Kaveri, its client computing CPU/GPU combo first described last year. It was worth a closer look because it's the first chip to support a coherent connection and full memory sharing between the CPU and GPU cores thanks to AMD's Heterogeneous Systems Architecture. Now the big question is, who will have the second HSA-compliant chip? And when?
AMD did a deep dive on Kaveri, its client computing CPU/GPU combo first described last year. It was worth a closer look because it's the first chip to support a coherent connection and full memory sharing between the CPU and GPU cores thanks to AMD's Heterogeneous Systems Architecture. Now the big question is, who will have the second HSA-compliant chip? And when?
Chip stacks get real
Xilinx pioneered 2.5-D chip stacks putting memory and FPGA next to each other on a substrate. SK Hynix said that's just the start, with graphics apps coming next followed by networking chips...and someday maybe even the Holy Grail of smartphones. The company detailed the advantages of its High Bandwidth Memory offering (see below).
Xilinx pioneered 2.5-D chip stacks putting memory and FPGA next to each other on a substrate. SK Hynix said that's just the start, with graphics apps coming next followed by networking chips...and someday maybe even the Holy Grail of smartphones. The company detailed the advantages of its High Bandwidth Memory offering (see below).
Wireless chip stacks
Startup ThruChip Communications has found a way to wirelessly distribute power across a chip, said microprocessor veteran Dave Ditzel. The technique (above) when combined with its inductive coupling method for passing data between chip die provides an alternative to expensive and complex through silicon vias, he said. The coupling technology is looking even better for those using the new ultra-thin wafers (see below) now emerging from the labs because the thin chips allow for smaller coils, he added.
Startup ThruChip Communications has found a way to wirelessly distribute power across a chip, said microprocessor veteran Dave Ditzel. The technique (above) when combined with its inductive coupling method for passing data between chip die provides an alternative to expensive and complex through silicon vias, he said. The coupling technology is looking even better for those using the new ultra-thin wafers (see below) now emerging from the labs because the thin chips allow for smaller coils, he added.
FPGAs, Bitcoin rising
Two of the hottest Hot Chip talks came from outside the mainstream computing field the conference usually addresses. Microsoft's plan to adopt Altera FPGAs to accelerate Bing in its data centers opens a new door for programmable logic (above), a shift Baidu also said it supports. Separately, a bitcoin mining startup beat speed records getting full systems out the door in well less than a year (see below) thanks to a high degree of design re-use.
Two of the hottest Hot Chip talks came from outside the mainstream computing field the conference usually addresses. Microsoft's plan to adopt Altera FPGAs to accelerate Bing in its data centers opens a new door for programmable logic (above), a shift Baidu also said it supports. Separately, a bitcoin mining startup beat speed records getting full systems out the door in well less than a year (see below) thanks to a high degree of design re-use.
责编:Quentin