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深圳市江波龙电子股份有限公司
QLC eMMC：一马当先，率先推出QLC eMMC，搭配江波龙自研主控芯片WM6000，先进制程，更高密度，性能稳定，为大容量手机市场加持。xSSesmc
闪存介质：3D QLCxSSesmc
接口：eMMC 5.1xSSesmc
容量：128GB / 256GB / 512GBxSSesmc
顺序读写速度：Up to 340MB/s / 300MB/sxSSesmc
产品应用：智能手机xSSesmc
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ePOP4x：集成了eMMC和LPDDR的复合产品，为穿戴式设备量身定做。对比eMCP产品厚度更薄、尺寸更小。xSSesmc
协议：eMMC 5.1 + LPDDR4xxSSesmc
容量：32GB+16Gb / 64GB+16Gb xSSesmc
DRAM频率：2133MHzxSSesmc
球数：144ballxSSesmc
尺寸：8*9.5*0.8 mmxSSesmc
工作温度：25-℃~85℃xSSesmc
工作电压：DRAM: VDD1=1.8V,VDD2=1.1V,VDDQ=0.6V;xSSesmc
eMMC: VCC : 2.7~3.6V, VCCQ: 1.7~1.95V/2.7~3.6VxSSesmc
产品应用：智能手表xSSesmc
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