苹果三星相争，台湾半导体业得利

据台湾经济新闻报道，尽管目前全球经济形势一片惨淡，台湾半导体行业供应链在2011年下半年仍然被寄予厚望。这一切都将归功于新一代苹果产品的需求推动。 该报告称，预计苹果即将推出的产品包括了新一代MacBook Air，iPhone4S和iPad3，并将在8月份开始采购芯片。 但是台积电（Taiwan Semiconductor Manufacturing Co. Ltd）和联华（United Microelectronics Corp.），以及其他一些台湾半导体封装公司，均不约而同地预计第三季度晶圆增长会下降。 根据一份行业观察家的报告，苹果早已经完成了新产品的技术规格书、芯片列表和一系列验证流程，并已给供应商下订单。这可能是台湾半导体产业在第三和第四季度打翻身仗的关键所在。 报告还称，高通是苹果手机IC的主要供应商，台积电和日月光（Advanced Semiconductor Engineering Inc）都很有希望在八月或九月拿到他们的IC代工订单。 在报告中列出其他有可能受益的厂商和产品包括：颀邦科技（Chipbond Technology Inc.），Ardentek，瑞萨（Renesas）和德州仪器（TI）。 以及瑞昱半导体（Realtek Semiconductor Corp.）的以太网芯片，旺宏（Macronix International）用于BIOS的NOR flash，创惟(Genesys)的读卡器芯片和立锜科技（Richtek Technology）的电源管理芯片。 编译：Luffy Liu 本文授权编译自EE Times，版权所有，谢绝转载 参考英文原文：Taiwan comforted by Apple chip spend cycle，by Peter Clarke

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{pagination} Taiwan comforted by Apple chip spend cycle Peter Clarke LONDON – Despite concern about the global economic situation Taiwan is taking comfort from an expected cycle of semiconductor purchasing to come in the second half of 2011, driven by the needs of forthcoming Apple products, according to a Taiwan Economic News report. Apple is expected to start buying chips for upcoming products including the Macbook Air, iPhone 4S and iPad 3, in August, the report said. Foundries Taiwan Semiconductor Manufacturing Co. Ltd. and United Microelectronics Corp. as well as packaging companies in Taiwan have reduced estimates of wafer growth in the third quarter. However, Apple has completed the technical specifications, chip lists and certification processes for a number of its products and placed orders with suppliers, according to the report, which cited industry observers as sources. This is likely to benefit the Taiwan semiconductor industry in the third and fourth quarters. Qualcomm is the major supplier of handset ICs for Apple and Qualcomm is expected to place orders with TSMC and packaging firm Advanced Semiconductor Engineering Inc. in August or September the report said. Other likely beneficiaries listed in the report are likely to be Chipbond Technology Inc. and Ardentek Corp. performing packaging for Renesas and Texas Instruments, Realtek Semiconductor Corp. for Ethernet chips, Macronix International for NOR flash memory for BIOS, Skyworth Group for memory card reader chips and Richtek Technology for power management chips.