罕王斥资30亿在辽宁抚顺兴建MEMS晶圆厂

沈阳罕王集团是中国东北的大型民营铁矿生产集团，该公司已开始为微机电系统(MEMS)兴建一家大型晶圆厂。 罕王集团打算生产惯性传感器和硅膜麦克风，这两种产品在中国都有旺盛的需求。该公司也在讨论生产胎压传感器和用于医疗应用的微流体MEMS。中国目前生产的大量电子设备所使用的MEMS器件，几乎全部需要进口。由于没有关税和劳动力成本较低，罕王MEMS器件的成本将低于进口产品，因此应该能够在中国系统生产商中找到买家。 为了实现上述目标，罕王集团成立了合资子公司Hanking Electronics Co. Ltd.，并聘请MEMS产业资深人士Doug Sparks担任执行副总裁帮助实施相关计划。Sparks向总裁兼首席执行官Lucy Huang报告。

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晶圆厂2012年3月动工兴建，位于沈阳以东40英里左右的抚顺。Sparks表示，工厂将坐落在罕王MEMS工业园(HMIP)之中，道路已经在2011年平整完毕。工业园位于抚顺经济开发区，占地约160英亩。 罕王计划投资30亿元人民币(约4.75亿美元)，分三个阶段进行开发。Sparks表示，尽管初期准备安装200毫米晶圆生产设备，但厂房是为满足“300毫米晶圆生产”建造的。他预测，将在几年内向生产300毫米MEMS晶圆过渡，目前MEMS领域还没有一家厂商能够生产300毫米晶圆。 Sparks表示，MEMS晶圆厂在第一阶段，将能够在2014年每月生产大约4000个200毫米初制晶圆。他说，“我们将在2013年以前拥有后端处理制程，比如电镀与蚀刻，再过一年可能就会拥有一切制程。” 但Sparks并不十分担心进度拖延。他说，罕王进入MEMS领域是一项长期计划，而且资金充足。中国罕王控股有限公司是罕王集团的附属企业之一，2011年9月在香港上市，2011年净利润为6.706亿元人民币，营业收入为14.5亿元人民币(约合2.3亿美元)。Sparks表示，整个集团的年营业收入约为5.5亿美元。

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本文下一页：先做代工，再图品牌 本文授权编译自EE Times，版权所有，谢绝转载

相关阅读：
• 2011年全球MEMS代工厂TOP20排行
• 温湿度传感器普及还缺什么？
• 更快更高更强！MEMS在运动领域N9resmc

{pagination} 先代工，再采取IDM模式，同时引进MUMPS？ Sparks表示，罕王希望最终成为MEMS IDM厂商，生产自有品牌的元件，不过届时可能有70%的自有品牌业务和30%的代工业务。但是，在实现那一步之前，罕王最初可能需要向主要MEMS厂商提供代工服务。 Sparks表示，他一直在考虑与MEMS IDM厂商和代工厂商合作。如果能够成为一家MEMS厂商的中国代工者，罕王就可以安装“一模一样”的设备，在为其生产产品的同时，也可以学到MEMS技术。Sparks表示，“我们一直在与几家潜在的战略伙伴谈判，”但他拒绝透露具体的公司名称。 Sparks表示，他也在与MEMS代工厂商Memscap SA (法国Bernin)接触，准备把MUMPS系统引入中国。MUMPS是标准化制程模组系统，可以让不同的客户共享晶圆面积，类似于CMOS中的多项目晶圆(MPW)方式。 MUMPS代表Multi-User MEMS Processes(多用户MEMS工艺)，最初是1980年代在美国加州大学伯克利分校开发的一个项目，后来转到了美国北卡罗菜纳微电子中心 (MCNC)，并成为向研究人员提供MEMS流片服务的一个手段。该服务后来转让给了Cronos Integrated Microsystems Inc.，包括在北卡罗来纳州三角研究园的一个晶圆厂。后来于2003年被Memscap收购。Memscap利用该设施向客户提供MEMS流片服务，然后投入批量生产。 Sparks表示，如果能够使用这样的低成本系统，中国许多小型公司可能对MEMS感兴趣。罕王在美国克利夫兰也设有办事处。他说，“我们已开始在那里进行一些设计工作，以启动这个项目。” Sparks还补充道，Hanking Electronics也考虑在无线传感器网络领域，并打算给中国的一些相关电子产品贴牌销售，以此扩大其销售与市场基础。 罕王并不是在中国建立MEMS工厂的第一家公司。1999年从模拟器件公司分拆出来的美国Memsic Inc.，在无锡建立了一家后端工厂，使用加工过的台积电CMOS晶圆。 2011年10月接受Hanking Electronics的现有职务之前，Sparks曾在美国MEMS公司Integrated Sensing Systems Inc.工作过10年，再早在Delco从事汽车MEMS工作17年。Delco已更名为Delphi。 Sparks在Delphi期间，聘用了一名来自美国凯斯西储大学(Case Western Reserve University)的中国硕士毕业生Lucy Huang，即Hanking Electronics的现任总裁兼首席执行官。 编译：Luffy Liu 本文授权编译自EE Times，版权所有，谢绝转载 参考英文原文：Hanking starts building Chinese MEMS wafer fab, by Peter Clarke

相关阅读：
• 2011年全球MEMS代工厂TOP20排行
• 温湿度传感器普及还缺什么？
• 更快更高更强！MEMS在运动领域N9resmc

{pagination} Hanking starts building Chinese MEMS wafer fab Peter Clarke Hanking Group (Shenyang, China), a mining and metal processing conglomerate in the north-east of China, has begun building what could become a major wafer fab for the manufacture of microelectromechanical systems (MEMS). Hanking is looking to make inertial sensors and silicon membrane microphones which are all in high demand in China, but has also talked about tire pressure monitor sensors and microfluidic MEMS for medical applications. China currently imports almost all the MEMS devices used in the high volumes of electronic equipment made in the country. The company should be able to find ready buyers at Chinese system makers for the components which would be lower cost than imported MEMS due to an absence of duties and lower labor costs. The group has created a wholly-owned subsidiary, Hanking Electronics Co. Ltd., as the means to achieve its goal and recruited MEMS industry veteran Doug Sparks as executive vice president to help execute the plan. Sparks reports to Lucy Huang, president and CEO. Construction of the wafer fab started in March 2012 in Fushun about 40 miles east of Shenyang. The buildings will sit in the Hanking MEMS Industrial Park (HMIP) which occupies about 160 acres in Fushun Economic Development Zone and for which the roads were laid out during the 2011 construction season, Sparks said. Hanking has committed to spend 3 billion yuan (about $475 million) on three phases of development there. Although Sparks is looking to install 200-mm equipment initially, the building is being made "compatible with 300-mm wafer production," he said. The transition to 300-mm wafer processing for MEMS, something not yet done by any manufacturers in the MEMS sector, would come in a few years, Sparks predicted. The first phase of the MEMS wafer fab will be capable of producing about 4,000 200-mm wafer starts per month in 2014, Sparks said. "We'll have the back-end processing – things like electroplating and bulk etch going by 2013 – It may be another year before we have everything running," he said. But Sparks is not too concerned about delays. Hanking is into MEMS for the long haul and has money to spend, he said. China Hanking Holdings Ltd., one of the affiliates of the Hanking Group, was admitted to the Hong Kong stock exchange in September 2011 and declared a net profit of 670.6 million yuan (about $106 million) on sales revenue of 1.45 billion yuan (about $230 million) for 2011. However, Sparks said total group annual revenue is about $550 million. Foundry first, then IDM, meanwhile MUMPS? Ultimately Hanking wants to be a MEMS IDM making components under its own badge, although it may then run a mix of 70 percent own-brand and 30 percent foundry wafers, Sparks said. However, before it can do that it will likely need to start by offering foundry services to eastablished MEMS manufacturers. Sparks said that he has been looking at partnerships with MEMS IDMs and foundries. A contract to be a China-based manufacturer on behalf of a MEMS maker would let Hanking install a "copy-exact" equipment line and begin to learn its MEMS skills while making product for someone else. "We've been talking to a couple of potential strategic partners," said Sparks but he declined to reveal names. Sparks said that he was also talking to MEMS foundry Memscap SA (Bernin, France) about bringing the MUMPS system to China. MUMPS is a system of standardized process modules that enables the sharing of wafer area by multiple customers, similar to multiproject wafer (MPW) runs in CMOS. MUMPS stands for Multi-User MEMS Processes. It is a program that was originally developed at the University of California Berkeley in the 1980s before moving to Microelectronics Corporation of North Carolina (MCNC) and brought up as a means of providing academics with access to MEMS prototyping. The service was transferred to Cronos Integrated Microsystems Inc. including a wafer fab in Research Triangle Park, North Carolina, which was then acquired by Memscap in 2003. Memscap uses the facility to provide customers with access to MEMS prototyping and then transition to volume manufacturing. Sparks said that a lot of small companies in Chinese could be interested in MEMS if they could access such a low-cost access system. Hanking also has offices in Cleveland, Ohio. "We've started doing some designs there to get things off the ground," said Sparks. Sparks added that Hanking Electronics is also looking to re-label and some electronic products in China in the area of wireless sensor networks as a means of building up its sales and marketing infrastructure. Hanking is not the first company to build a MEMS fab in China. Memsic Inc. (Andover, Mass.), a 1999 spin-off from Analog Devices Inc. constructed a back-end fab in Wuxi that worked with processed CMOS wafers from Taiwan Semiconductor Manufacturing Co. Ltd. Before taking up his current position with Hanking Electronics in October 2011, Sparks had worked with MEMS company Integrated Sensing Systems Inc. (Ypsilanti, Michigan) for ten years and prior to that had worked on automotive MEMS for 17 years at Delco which became Delphi. It was while Sparks was at Delphi that he hired a Chinese MSc. graduate from Case Western Reserve University (Cleveland, Ohio), Lucy Huang, who subsequently landed the top job at Hanking Electronics.