英特尔IDF是X86对ARM宣战的誓师会

在针对未来计算机运算大战开打以前，AMD、ARM、苹果(Apple)与英特尔(Intel)几家业界巨擘正为本周一场具关键性的小规模前哨战作好了准备。这一场悠关谁将取得云端市场而谁又能主导移动终端的前哨战本周将在英特尔开发者论坛(IDF)期间悄悄展开。 在美国旧金山IDF期间，英特尔公司将发表新的客户端与服务器产品与开发蓝图，以捍卫其于Ultrabook到百万兆次(exascale)级超级计算机等领域的地盘。该公司还将试图在至今尚未站稳脚跟的智能手机、平板电脑与物联网(IoT)等热门行动市场占有 一席之地。 英特尔的主要竞争对手──AMD与ARM，也将针对相同的整个领域展开左右夹击行动，将为英特尔带来更大的竞争威胁。以下是即将在本周发生的几件业界头号大事。 AMD在周一(9月10日)举办了一场新闻发布会，说明该公司收购SeaMicro及取得服务器技术后的发展计划细节。我们已经知道SeaMicro公司的互连技术将继 HyperTransport 后成为 Freedom Fabric 的技术基础，AMD并将为 x86 与ARM芯片建立一项业界标准──同时也是打造各种大型资料中心系统的关键基础。

SeaMicro公司在其原型板上以ASIC建置的专有互连技术，如今已成为AMD Freedom Frbric的一部份。
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就在AMD将召开记者会的同一天晚上，英特尔公司也将邀请媒体与其服务器业务主管餐叙。该公司也将同时在周一发布互连技术计划相关演示文稿。 英特尔先前收购Cray公司的互连部门以及QLogic公司的Infiniband业务，正说明了该公司的计划。很显然地，英特尔的目标在于强化其处理器上的专有 Quick Path Interconnect 与CPU指令集的连结，以实现高性能运算与各种云端应用。 最近在 Hot Interconnects大会的一场主题讨论中，与会工程师们热切探讨英特尔的计划及其意涵。其中一位RaipdIO组织的代表表示正积极推动他们的技术，以作为可应用在ARM服务器SoC上的一项业界标准。 值得注意的是，在互连技术战火结束以前，还会有多家新创公司投入竞争。新创的KandouBus公司正以一项与瑞士洛桑学院共同开发的超快速新技术伺机而动。 ARM当然也不会错过跻身本周新闻头条的机会。周一下午，ARM在距离IDF会场Moscone West会议中心附近的办公室也对外开放。ARM行动与服务器部门主管将说明公司的发展计划。 这真是一个令人振奋的时刻。不过，互连技术之争还只是一个复杂且吸引人的部份，业界厂商更看重的还是关键的云端运算领域。 我们也期望能了解更多有关英特尔Ultrabook的新处理器产品。这些处理器在 Windows 8 正式发表前几周首次亮相，将可同时支持 x86 和 ARM SoC，以应用于多款平板电脑中。AMD也将在此上演新戏码，在新的管理团队下，预计将在2013年推出一款低于5W的 Temash 芯片。 苹果将正好位于这场移动战火的中心位置。在IDF期间，苹果公司预计将在旧金山的Yerba Buena Center正式发表众所期待的 iPhone 5 ，这与英特尔将大力宣传其 Medfiel d智能手机平台及其相关产品的时间几乎相同。 本文授权编译自EE Times，版权所有，谢绝转载 编译：Susan Hong 参考英文原文：Intel forum is next front in x86 vs ARM war，by Rick Merritt

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{pagination} Intel forum is next front in x86 vs ARM war Rick Merritt AMD， ARM， Apple and Intel are gearing up for a small but significant skirmish next week in the big war over the future of computing—and it’s all happening around IDF。 SAN JOSE， Calif。 – Next week's Intel Developer Forum is shaping up as the next front in the battle over who will own the cloud and who will own the mobile client。 During IDF in San Francisco， Intel will roll out new client and server products and initiatives to defend its turf in everything from ultrabooks to exascale supercomputers。 It also will try to grab some territory in hot mobile markets like smartphones， tablets and the Internet of Things were it lacks a firm foothold today。 Arch-rivals Advanced Micro Devices and ARM are setting up flanking actions all across the same terrain。 Here’s a bit of what it looks like from our vantage point。 Monday (Sept 10)， AMD will host a press event to provide the first details about what it will do with the server technology it acquired with SeaMicro。 We already know SeaMicro’s interconnect will form the basis of a follow on to HyperTransport AMD will name Freedom Fabric and try to make an industry standard for an ecosystem of x86 and ARM chips—a key plank for building big data center systems of all sorts。 SeaMicro used ASICs on its original boards to implement the proprietary interconnect now part of AMD’s Freedom Fabric。 As AMD prepares its advance， Intel is inviting press to a small group dinner Monday night with one of the heads of its server business。 It has also put together a pre-briefing on its interconnect plans that will be announced Monday (Sept。 10)。 Intel’s acquisitions of Cray’s interconnect group and the Infiniband business of QLogic telegraphed Intel’s plans。 Clearly， the company aims to bolster the proprietary Quick Path Interconnect on its processors to link clusters of CPUs for high performance computing and other uses in the cloud。 The engineers at Hot Interconnects recently devoted a whole panel to speculating on Intel’s plans and their implications。 At the panel a representative of the RapidIO trade group said it is pitching its technology as a standard for use on ARM server SoCs。 Wild cards Watch for wild card players to parachute in before this interconnect battle is over。 Startup Kandou Bus is waiting in the wings with an ultra-fast new technology created by an academic in Lausanne， Switzerland。 ARM is elbowing its way into next week’s headlines， too。 It’s hosting a Monday afternoon open house at offices near the Moscone West convention center that will host IDF。 There ARM mobile and server execs will regale the press with their plans。 It’s a heady time。 The interconnect battles are just one complex and fascinating part of it that’s central to cloud computing。 We also expect to hear about new Intel ultrabook processors。 They debut just weeks before the formal roll out of Windows 8 that will enable both x86 and ARM SoCs to power a variety of tablets。 AMD has a new play here too， under its new management， with a sub-5W Temash chip coming next year。 Apple will be right in the midst of the mobile battle。 During IDF it is expected to formally launch its much expected iPhone 5 at San Francisco’s Yerba Buena Center， spitting distance from IDF， at almost the exact same time Intel will be trumpeting its Medfield smartphone platform and its follow-ons。