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夏普据称与英特尔及高通磋商投资事宜

陷入资金困境的夏普据称在与英特尔及高通详细磋商投资事宜,金额高达5亿美元。夏普年度亏损估计达56亿美元,面临沉重压力,急需这笔投资……

据日本共同社周二(11月14日)报道,陷入资金困境的夏普据称在与英特尔及高通详细磋商投资事宜,金额高达5亿美元。 路透社周三亦援引两名了解谈判情况的消息人士报道称,英特尔与高通对夏普的联合投资总计约为3.78亿美元。 相关公司均未证实上述谈判。 夏普急需这笔投资。英特尔是全球最大的CPU供应商,而高通是全球领先的移动芯片供应商。夏普年度亏损估计达56亿美元,面临沉重压力。夏普本月稍早警告称,作为独立公司可能难以继续生存。在11月1日宣布巨额季度亏损之后,该公司承认了“严重的负营业现金流”。 据说英特尔对于夏普的省电型IGZO显示器感兴趣,考虑用于其超级本产品上面。 路透社报道称,夏普最快可能在11月底与高通达成协议,而“与英特尔的谈判则没有那么确定,因为英特尔财务状况不太明朗”。 其它投资者? 夏普与台湾EMS巨头鸿海之间的谈判持续了一年多。双方谈判在8月份因价格问题陷入僵局。鸿海打算收购夏普9.9%的股份,但价格没有谈拢。本月稍早,夏普社长奥田隆司暗示,夏普也在“考虑其它联盟”。 本文授权编译自EE Times,版权所有,谢绝转载 本文下一页:除了英特尔与高通以外的那些人

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{pagination} 除了英特尔与高通以外,据称夏普还接触了苹果、谷歌、微软、戴尔和惠普,准备利用其LCD技术来换取金融援助。 夏普深陷困境,缘于对电视大尺寸液晶面板的巨额投资。为了追赶三星,夏普高层追求在面板生产方面实现规模经济。但在资金投出去之后,电视市场却不断下滑,尤其是在日本。 夏普的技术包括IGZO (氧化铟镓锌)和in-cell技术,可以把触控传感器直接集成到液晶面板里面。苹果的新款iPad和iPhone 5采用了这些面板技术。苹果去年向夏普提供金融支持,帮助其改造了一家原来生产大尺寸电视面板的工厂,使其转产用于移动设备的面板。 夏普新型IGZO面板出货时间比计划延后了将近半年。这些面板原计划用于3月推出的苹果新款iPad之中。夏普龟山工厂在苹果9月宣布计划推出新款iPhone的同一天,开始为iPhone 5量产in-cell面板。 2012年迄今,夏普的市值缩水四分之三。夏普9月从与其往来的主要银行三菱东京日联与瑞穗银行获得3600亿日圆贷款保证。这些贷款应该能够帮助夏普度过截止于2014年3月的下一个财年。 编译:Luffy Liu 本文授权编译自EE Times,版权所有,谢绝转载 参考英文原文:Sharp said to be in talks with Intel, Qualcomm, by Junko Yoshida

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{pagination} Sharp said to be in talks with Intel, Qualcomm Junko Yoshida TOKYO – Japan’s cash-strapped Sharp Corp. is reportedly in detailed talks with both Intel Corp. and Qualcomm Inc. for an investment of up to $500 million, the Kyodo News agency reported Tuesday (Nov. 14). Reuters also reported Wednesday that the joint investment in Sharp would total about $378 million. The news agency cited two unnamed sources allegedly familiar with the talks. None of the companies has confirmed the talks. The investment by the world’s largest CPU vendor and the leading mobile chip supplier is badly needed by Sharp, which is weighted down by an expected annual loss estimated at $5.6 billion. Sharp warned earlier this month that it may not be able to survive as an independent company. After announcing a massive quarterly loss on Nov. 1, the company acknowledged "serious negative operating cash flow." Intel is said to be interested in Sharp’s power-saving IGZO displays for its Ultrabook line. Reuters reported that Sharp may reach an agreement as early as the end of November with Qualcomm, while "talks with Intel are less concrete amid the chip maker's unclear financial picture." Other investors? Sharp has been negotiating with Taiwan EMS behemoth Hon Hai for over a year. Those talks reached an impasse in August over what price Hon Hai would pay for acquiring a 9.9 percent stake in Sharp. Earlier this month, Sharp president Takashi Okuda signaled that the company is also "considering other alliances." Beyond Intel or Qualcomm, Apple, Google, Microsoft, Dell and Hewlett-Packard were reportedly approached by Sharp for financial help in exchange for access to Sharp’s LCD technology. Sharp’s mounting problems stem from it massive investment on large-screen LCD panels for TVs. In hopes of catching Samsung, Sharp's top management sought to achieve economies of scale in its panel production. But TV market dropped just as the investments were made, especially in Japan. Sharp's technologies include its IGZO (indium-gallium-zinc oxide) and in-cell technologies, which integrate touch sensors directly into LCD panels. The panel technologies were adopted by Apple in the new iPad and iPhone 5. Apple extended financial support to Sharp last year in remodeling a fab originally built to produce large-screen TV displays to produce screens for mobile devices. Sharp missed the delivery date of new IGZO panels by nearly half a year. They were supposed to be designed into Apple’s new iPad unveiled in March. Volume production of in-cell panels for Apple's iPhone 5 commenced at Sharp's Kameyama plant on the same day that Apple announced plans in September to release a new iPhone. Sharp has lost three quarters of its value so far in 2012. It received a guarantee for 360 billion yen in loans from its two main lenders, Bank of Tokyo-Mitsubishi UFJ and Mizuho Corporate Bank, in September.The loans should sustain the company through its next financial year in March 2014.
责编:Quentin
本文为国际电子商情原创文章,未经授权禁止转载。请尊重知识产权,违者本司保留追究责任的权利。
Junko Yoshida
ASPENCORE全球联席总编辑,首席国际特派记者。曾任把口记者(beat reporter)和EE Times主编的Junko Yoshida现在把更多时间用来报道全球电子行业,尤其关注中国。 她的关注重点一直是新兴技术和商业模式,新一代消费电子产品往往诞生于此。 她现在正在增加对中国半导体制造商的报道,撰写关于晶圆厂和无晶圆厂制造商的规划。 此外,她还为EE Times的Designlines栏目提供汽车、物联网和无线/网络服务相关内容。 自1990年以来,她一直在为EE Times提供内容。
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