随着新一代旗舰手机小米5的发布，小米一时风头正劲；“为发烧而生”的极致精神，一系列黑科技的集中公布，加上成功的营销手段，使之在市场上产生了爆炸性的信息风暴，小米5可以说做到了万众瞩目。国内研究机构上海微技术工研院SITRI通过深度拆解小米5，透视小米5“黑科技”的真面目，了解小米5那些传感器sensor的内部构造。Wjjesmc
Components Arrangement（零部件排布）
Major Components（小米5主要元器件）Wjjesmc
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骁龙820芯片——聚焦小米5整机散热Wjjesmc
主芯片的功能强弱对手机整体性能起到决定性作用，万众瞩目的全新骁龙820处理器较上一代处理器CPU性能提升一倍之多。首次采用的14nm制程，从精密的工艺上带来更低功耗，再引入“低功率岛”技术，以超低电量负责传感器等任务，获得更出色的电量控制。小米5作为第一款上市的携带骁龙820处理器的手机，让我们一观其主芯片真面目。Wjjesmc
主芯片采用POP封装，三星POP堆叠模式的主要对手为抗台积电InFO工艺，上面是SK Hynix的内存芯片。下面的就是骁龙820处理器，高通型号为MSM8996。
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高通上一代的处理器由于发热问题而广受诟病，同时也使得手机的散热能力被人们广泛讨论，甚至于近期MWC发布的三星S7手机曝光使用了水冷散热技术，那么让我们来探究下采用骁龙820处理器的小米5对于散热是怎么做的。Wjjesmc
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小米5在处理器和2颗电源管理芯片表面都附加了导热硅脂，用于给芯片降温散热。后盖和中框都贴有大面积的石墨散热层，主要用于电池和显示屏的散热问题。3片导热硅脂加前后石墨散热层的模式构成整机散热体系，针对主要发热芯片和部件，使之在整机散热方面有不俗的表现。Wjjesmc
手机系统和处理器决定手机的运行速度，而手机的应用功能全靠传感器。作为智能手机必不可少的部分，接下来我们盘点下小米5使用的那些传感器，以及小米5的供应商都有哪些？Wjjesmc
小米5的sensor型号列表Wjjesmc
本文下一页：4轴防抖技术核心：6-Axis惯性传感器Wjjesmc
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4轴防抖技术核心：6-Axis惯性传感器Wjjesmc
小米5的惯性传感器选用了InvenSense的产品。这颗6-Axis惯性传感器ICG-20660L的封装尺寸为3.00 mm x 3.00 mm x 0.75 mm。Wjjesmc
ICG-20660L芯片不同于Invensense之前的MPU系列产品，其特点在于支持OIS（Optical Image Stabilization）和EIS（Electronic Image Stabilization）功能，就是小米5创新推出的4轴防抖功能的技术核心。
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Package Photo（封装尺寸）:Wjjesmc
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X-Ray Photo（X射线曝光）：Wjjesmc
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ASIC & MEMS Die Photo（ASIC及MEMS模组）：Wjjesmc
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ASIC Die Photo（ASIC模组内部照）Wjjesmc
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ASIC Die Mark（ASIC标签）Wjjesmc
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MEMS Die Photo（MEMS模组内部照）Wjjesmc
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MEMS Die Mark（MEMS标识）Wjjesmc
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本文下一页：Bosch气压传感器BMP280内部构造Wjjesmc
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Bosch气压传感器BMP280内部构造Wjjesmc
气压传感器首次在智能手机上使用是在Galaxy Nexus上，气压传感器的应用愈发普及，甚至可以监测气象数据。目前，手机气压传感器可以用来辅助GPS，让三维定位更加精准，测量出所处的高度，解决错误导航，配合加速计、陀螺仪等技术就可以做到精准的室内定位。Wjjesmc
小米5采用了常规的Bosch气压传感器BMP280，其封装尺寸为2.50 mm x 2.00 mm x 0.95 mm。
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Package PhotoWjjesmc
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Package Photo after Remove Metal Cap（揭封，移动金属盖）Wjjesmc
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X-Ray PhotoWjjesmc
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ASIC Die PhotoWjjesmc
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ASIC Die MarkWjjesmc
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MEMS Die PhotoWjjesmc
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MEMS Die MarkWjjesmc
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本文下一页：电子罗盘采用日本AKM公司芯片Wjjesmc
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电子罗盘采用日本AKM公司芯片Wjjesmc
手机电子罗盘，是手机一个软件，也是手机的一个硬件，能根据手机的位置不同显示方向和俯仰角。小米手机曾在导航上备受诟病，不过小米5在导航方面性能出众。Wjjesmc
电子罗盘采用了日本AKM公司的产品，CSP封装，其封装尺寸为1.60 mm x 1.60 mm x 0.40mm。Wjjesmc
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Package PhotoWjjesmc
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Die PhotoWjjesmc
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Die MarkWjjesmc
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本文下一页：台湾IC厂商供货光传感器Wjjesmc
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台湾IC厂商供货光&距离传感器Wjjesmc
小米5的环境光和距离传感使用了Capella Micro（台湾凌耀科技）的光传感器CM47397。 其封装尺寸为4.05 mm X 2.00 mm X 1.38 mm。 Wjjesmc
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Package PhotoWjjesmc
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Package X-Ray Photo
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Die PhotoWjjesmc
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Die MarkWjjesmc
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本文下一页：陶瓷盖板下的按压式指纹传感器Wjjesmc
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陶瓷盖板下的按压式指纹传感器Wjjesmc
指纹传感的功能第一次在小米5上得到了实现，和苹果手机一样，指纹模块和Home键做在了一起，但采用了陶瓷盖板（苹果的指纹模块采用的是蓝宝石盖板）。从外观上来看，小米5扁扁长长的Home键和三星手机的Home键极其相似，但却是实实在在的按压式指纹传感器（三星手机采用的是滑动式指纹传感器），因小米升级改进了指纹识别算法，其指纹识别对于信息量的要求会有所减少，故而小米5的Home键即使比较小，也能达到按压式指纹识别的应用效果。Wjjesmc
整个指纹模块尺寸为26.45 mm X 16.90 mm X 2.20 mm。Wjjesmc
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Package PhotoWjjesmc
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Sensor Die PhotoWjjesmc
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本文下一页：小米5手机3个麦克风都来自楼氏Wjjesmc
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小米5手机3个麦克风都来自楼氏Wjjesmc
小米5的3个麦克风都来自楼氏， 这3颗除了封装表面Mark略有不同，里面的MEMS Die全都一样。
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麦克风1
Package PhotoWjjesmc
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Package Mark
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X-Ray PhotoWjjesmc
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MEMS Die PhotoWjjesmc
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MEMS Die MarkWjjesmc
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MEMS Die SEM SampleWjjesmc
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麦克风2Wjjesmc
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Package PhotoWjjesmc
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麦克风3Wjjesmc
Package PhotoWjjesmc
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本文下一页：解析索尼16MP Image Sensor IMX298Wjjesmc
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解析索尼16MP的Image Sensor IMX298Wjjesmc
小米5的后置摄像头采用索尼16MP像素的IMX298，该芯片使用了DTI（Deep Trench Insulation）深沟槽隔离技术，简单理解，就是在感光像素之间加了一道道的墙隔离，从而减少像素与像素之间的光串扰，减小噪点，进而提高照片质量。Wjjesmc
小米5的后置摄像头还有一大创新，就是应用了4轴防抖技术，除去常规的上下左右（X轴和Y轴）2轴方向防抖功能，还新增了上下左右（X轴和Y轴）2轴方向的旋转防抖功能。它是使用了手机内的6轴传感器来高速检测这4轴方向的抖动，实时驱动微型马达（即自动对焦模块）来调整姿态，补偿抖动，实现了画质的稳定。Wjjesmc
Rear Image Sensor X-Ray Photo
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Rear Image Sensor Package PhotoWjjesmc
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Rear Image Sensor Die PhotoWjjesmc
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Rear Image Sensor Pixel OM SampleWjjesmc
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Front Image Sensor Package Photo
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Front Image Sensor Die PhotoWjjesmc
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小米5是目前能够现货购买到的最具性价比的安卓手机之一，骁龙820处理器，陶瓷指纹识别模块，4轴光学防抖相机模块等黑科技成为了本次小米5的最大亮点。Wjjesmc
